Phase growth in alpha brass with thin layer of electroplated zinc during homogenization annealing

نویسندگان

چکیده

Abstract Diffusion mechanism in between thin electroplated Zn coating and Cu – 37wt%Zn substrate during homogenization annealing substantially depends on electroplating parameters. Experiments carried out to determine phase growth solute profile at various current densities reveal that the increase of density tends reduce growth. The coefficient has been determined is found be dependent relative plating layer.

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ژورنال

عنوان ژورنال: SN applied sciences

سال: 2021

ISSN: ['2523-3971', '2523-3963']

DOI: https://doi.org/10.1007/s42452-021-04435-5